KUALA LUMPUR (June 18): RHB Retail Research said Techbond Group Bhd may rebound further after it tested the 66 sen support lately.
In a trading stocks note today, the research house said as the stock rose above the 21-day SMA line, this points to a positive sign.
“A bullish bias may appear above the 69 sen level, with an exit set below the 66 sen threshold.
“Towards the upside, the near-term resistance is at 74 sen. This is followed by the 77 sen level,” it said.