Sunday 19 May 2024
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KUALA LUMPUR (Nov 8): Global silicon wafer shipments increased 3.3% to 3,649 million square inches in the third quarter of 2021 (3Q21) as compared to the previous quarter, setting a new industry record, said US-based Semiconductor Equipment and Materials International (SEMI).

In its SEMI Silicon Manufacturers Group (SMG) quarterly analysis of the silicon wafer industry released on Nov 4, SEMI said 3Q21 silicon wafer shipments grew 16.4% from the 3,135 million square inches recorded during the same quarter of the previous year.

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronics, including computers, telecommunications products and consumer devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

SEMI SMG chairman and  Shin Etsu Handotai America vice-president of product development and applications engineering Neil Weaver said silicon wafer shipments reached a new high in 3Q21, with higher shipments in all diameters, which support the large variety of semiconductor devices needed for the modern economy.

“Silicon wafer demand is expected to remain high as many new fabs will ramp up in the next several years," he said.

Silicon area shipment trends semiconductor applications only

 

                                                                       Millions of square inches

 

2Q20

3Q20

4Q20

1Q21

2Q21

3Q21

Total

3,152

3,135

3,200

3,337

3,534

3,649

Source: SEMI (www.semi.org), November 2021

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