KUALA LUMPUR (July 13): Unisem (M) Bhd estimates its micro-electromechanical systems (MEMS) unit volume to grow over 50% in the next 12 months, as global MEMS device revenue is forecast to grow from US$11.9 billion (RM47.19 billion) last year to US$20 billion by 2021.

In a statement today, Unisem said it has recently shipped its one billionth packaged MEMS device, and it will continue to invest in both MEMS assembly equipment and the development of additional factory floor space for this expanding market.

MEMS, in its most general form, is defined as miniaturised mechanical and electro-mechanical elements (i.e. devices and structures) that are made using microfabrication. It is also referred to as micro machines in Japan.

The dimensions of MEMS devices can vary, from well below one micron to several millimeters. Hence, the types of MEMS devices can vary from simple structures with no moving elements to complex electromechanical systems with multiple moving elements under the control of integrated microelectronics.

Citing technology market research provider Yole Developement's forecast of MEMS device revenue growth to US$20 billion by 2021, Unisem said it sees MEMS as a strategic part of its technology and growth plans moving forward.

"Part of Unisem's growth strategy for MEMS packaging includes the dedication of additional factory floor space," it said.

In their factory in Chengdu, China, now, Unisem recently completed the installation and certification of a 1,200 sq m class 100 clean room to support the assembly needs of MEMS microphones, combination cavity packages, and other devices that either require or benefit from this level of controlled environment.

"In addition to this, Unisem also has brought in film assisted molding capability to support the expansion of their MEMS molded cavity package offerings.

"Film assisted molding allows Unisem to target both the automotive and industrial MEMS pressure sensor market as well as the growing market for consumer pressure, humidity, temperature, gas sensors and combinations of these," it said.

This technology, it added, enables Unisem to use leadframe based packages and to mold the sensor device itself leaving only the sensing area exposed in the cavity.

At 5pm today, Unisem, a global provider of semiconductor assembly and test services for electronics companies, saw its share price close down 1 sen (0.4%) to RM2.50, for a market capitalisation of RM1.83 billion.