KUALA LUMPUR (Dec 24): Home-grown semiconductor wafer foundry SilTerra Malaysia Sdn Bhd has inked an exclusive technology transfer partnership with Singapore-based technology developer IGSS GaN (IGaN) to reduce production costs with high-volume manufacturing capabilities that now includes larger wafer areas.
In a joint statement last week, the companies said the partnership will see mass production of this new technology in early 2019 and grow employment opportunities covering manufacturing process integration, and equipment engineering.
IGaN chairman and chief executive officer (CEO) Raj Kumar said this exclusive collaboration enables customers in power semiconductor to leapfrog into GaN technology devices, unlocking access to the huge opportunity of a US$12 billion (RM50.23 billion) power device market.
He explained that GaN devices — used for high power density, wireless power transfer applications — allow for higher server power, and is an innovative technology designed for exciting wireless charging applications far beyond low power applications such as cell phones and laptops.
He said the technology additionally enables greater energy savings and increased power density in data centres, significantly reducing operating and capital expenditures in areas of energy consumption.
Meanwhile, SilTerra CEO Firdaus Abdullah said SilTerra's achievement in delivering a process that allows for reduced costs represents its partnership's commitment to achieving the best yielding process and capacity assurance to fulfil its customers' business expectations.
"SilTerra also looks to leading the charge in pioneering solutions for the broader semiconductor space in Malaysia," he said.