KUALA LUMPUR (Feb 10): The US-based Semiconductor Equipment and Materials International (SEMI) has launched the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.
In a statement on its website yesterday, SEMI said the Special Interest Group (SIG) represents SEMI members who have semiconductor packaging, assembly, test manufacturing, or design activities in Europe.
It said the purpose of the SIG is to foster collaboration among companies and to collectively raise the profile and reinforce the semiconductor back-end industry in Europe.
SEMI said the newly formed executive committee of the SIG includes representatives from AEMTec, First Sensor, NANIUM, RoodMicrotec, Sencio, STMicroelectronics, and Swissbit. More than 20 additional companies from the European back-end supply chain have already expressed interest to join.
SEMI said SIG’s activities will include:
- Maintaining a strong back-end network in Europe
- Increasing awareness between European suppliers and device/packaging manufacturers
- Mapping and reporting capabilities and capacities of European SiPAT members
- Identifying gaps in the European back-end supply chain relative to other regions
- Advocating for the Packaging, Assembly, and Test industry in Europe
- Building project consortia and bidding for European funding