KUALA LUMPUR (April 20): Penang-based Qdos Holdings Bhd is investing up to RM35 million to introduce new cutting-edge technology in the local semiconductor industry.
In a statement today, Qdos business development director S. Suresh said that to-date, the company had invested RM25 million in equipment, manpower and technology transfer activites to develop the first-of-its-kind technology in the country.
“As we move forward, we expect to invest approximately RM10 million more in this year alone to manufacture the MIS circuits.
“The raw materials that were used in developing the MIS allows us to position the technology as a cost competitive solution and lower than BGA substrates with the same fine line design. We are confident that this advantage will augur well for the semiconductor industry within the Malaysian and Southeast Asia region,” he said.
Suresh said the Molded Interconnect Substrates (MIS) produced by QDOS, a pioneer manufacturer of Flexible Printed Circuits (FPC) in Malaysia, provides an innovative interposes solution in Ball Grid Arrays (BGA), Quad Flat No-lead (QFN) and fine pitch flip-chip semiconductor packaging.
Representing a breakthrough from the conventional polymer core, the MIS technology enables the production of super fine circuitry that can advance high performance applications, particularly equipment with 4G, low noise and high frequency requirements.