Thursday 18 Apr 2024
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KUALA LUMPUR (March 5): HeiTech Padu Bhd has bagged a contract from the Social Security Organisation (SOCSO) worth RM23.33 million for the development and integration of the latter's Scheme Management Application System.

In a filing with Bursa Malaysia, HeiTech said it accepted the letter of award issued by SOCSO today, and that the contract will be for 38 months, starting from March 13, 2019 to end on May 12, 2022.

HeiTech said the contract is expected to have positive effects on future earnings and earnings per share of the company.

HeiTech shares closed down 0.5 sen or 0.71% to 70 sen today for a market capitalisation of RM70.86 million.

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