Global semicon packaging materials market hit US$16.7b in 2017, says SEMI

-A +A

KUALA LUMPUR (Apr 19): The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to the U.S.-based Semiconductor Equipment & Materials International (SEMI).

In a statement on its website yesterday, SEMI said while slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018.

It said flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.

SEMI said the Global Semiconductor Packaging Materials Outlook shows that, despite growth in automotive electronics and high-performance computing, continuing price pressure and declining material consumption will constrain future material revenue growth to steady single-digits, with the materials market forecast to reach US$17.8 billion in 2021.

It said IC leadframes, underfill, and copper wire are among the materials segments that will see single-digit unit volume growth through 2021.