Global 2Q2019 silicon wafer shipments down 5.6% y-o-y, says SEMI

Global 2Q2019 silicon wafer shipments down 5.6% y-o-y, says SEMI
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KUALA LUMPUR (July 24): Global silicon wafer area shipments fell 5.6% year-on-year in the second quarter of 2019 to 2,983 million square inches, according to the US-based Semiconductor Equipment and Materials International (SEMI)

In its Silicon Manufacturers Group (SMG)'s quarterly analysis of the silicon wafer industry released yesterday, SEMI said the figure was down 2.2% quarter-on-quarter from the 3,051 million square inches shipped in the first quarter of the year.

Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics.

The highly engineered thin, round disks are produced in various diameters – from one inch to 12 inches – and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

SEMI SMG chairman and vice president of product development and applications engineering at Shin Etsu Handotai America, Neil Weaver said global silicon wafer shipment are being impacted by the same headwinds that are facing the broader industry.

“While shipment area growth is currently subdued, the long-term outlook for the industry remains positive,” said Weaver.