Thursday 25 Apr 2024
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KUALA LUMPUR (Dec 5): Industrial adhesive manufacturer Techbond Group Bhd rose 25% in active trade early this morning upon its listing on the Main Market of Bursa Malaysia Securities Bhd.

At 9.05am, Techbond rose 16.5 sen to 82.5 sen with 24.08 million shares traded.

The company is seeking to raise RM39.67 million from its initial public offering (IPO), will spend the bulk of the proceeds to finance its expansion in Vietnam.

Currently selling its products in Vietnam — the group’s biggest market — it also exports to neighbouring Cambodia. Techbond plans to set up a new facility in Vietnam with a view of expanding sales to other Indo-China markets, Lee told reporters at the launch of the group’s IPO prospectus yesterday.

According to the prospectus, 72.5% of the IPO proceeds will be used to finance the group’s expansion in Vietnam — RM10 million to build the new factory, RM12.74 million to buy machinery and equipment, and RM6.04 million for working capital.

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